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AEMCSE 2025: International Conference on Advanced Electronic Materials, Computers and Software Engineering

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AEMCSE
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Día de Entrega:
2025-04-21
Fecha de Notificación:
2025-05-05
Fecha de conferencia:
2025-05-09
Ubicación:
Nanjing, China
Ediciones:
8
Vistas: 14740   Seguidores: 2   Asistentes: 1

Índice Conference Partner (CP-I)

46,5 / 100
Puesto n.º 2.247 de 5.646 congresos · 40% superior

N.º 47 de 259 en Materiales, mecánica y fabricación N.º 143 de 246 en Ingeniería de software

Reconocimiento académico (35%) Sin datos: se puntúa con la línea base neutra de 50 —
Selectividad en la revisión (20%) Sin datos: se puntúa con la línea base neutra de 50 —
Ediciones celebradas (20%)
59
Atención de la comunidad (10%)
19
Integridad del registro público (15%)
35

Datos utilizados: Ediciones documentadas: 8 · Investigadores que lo siguen aquí: 2 · Investigadores que abrieron esta página en los últimos 24 meses: 2

Falta en el registro público: Tasas de aceptación históricas (+4,5) · Ediciones anteriores (+3,0) · Premios al mejor artículo (+2,3)
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Confianza 45 %: la parte de la puntuación respaldada por datos observados y no por la línea base neutra. Cómo se calcula esta puntuación · Ver la clasificación · Versión del algoritmo 1.1 · Calculado el 2026-08-30

Solicitud de Artículos

AEMCSE 2025 (International Conference on Advanced Electronic Materials, Computers and Software Engineering) is an academic conference held in Nanjing, China on 2025-05-09. The paper submission deadline is 2025-04-21. Acceptance notifications are sent on 2025-05-05.

The 2025 8th International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE 2025) will be grandly held in Nanjing, China, from May 9-11, 2025. This conference aims to provide a platform for scholars, researchers, and industry professionals worldwide to exchange the latest research findings and explore development trends. The conference will cover various fields, including but not limited to the design and application of advanced electronic materials, new developments in computer science, best practices in software engineering, innovative applications of artificial intelligence technologies, and information security. Renowned international experts will be invited to deliver keynote speeches, and multiple parallel sessions will be organized to facilitate in-depth discussions and collaborations among participants. AEMCSE 2025 offers valuable opportunities for participants to share research results, discuss technological challenges, and establish cooperative relationships. We sincerely invite experts and scholars from related fields to visit Nanjing and jointly promote the progress and innovation in electronic materials, computer science, and software engineering. PUBLICATION All papers, both invited and contributed, will be reviewed by two or three experts from the committees. After a careful reviewing process, all accepted full papers will be published by IEEE（ISBN:979-8-3315-1091-6), and submitted to IEEE Xplore, EI Compendex and Scopus for indexing. CALL FOR PAPERS Topics of interests are in the broad areas of electronic information technology and computer engineering, including but not limited to: l Electronic Information Technology · Artificial Intelligence and Machine Learning · Edge Computing and Internet of Things (IoT) · High-Performance Computing and Parallel Computing · Computer Vision and Image Processing · Computer Networking and Communications · Computer system and architecture design · Cybersecurity and Privacy Protection · Artificial Intelligence and Machine Learning System · Quantum Computer and Applications · Data Center Technology · Algorithm Design and Complexity · Signal processing · Optical communication · Information Security · Computer Networks and Distributed Computing · Embedded system · Integrated circuit · Optoelectronic devices l Software Engineering · Software Architecture and Design · Software Testing and Quality Assurance · Continuous Integration and Continuous Deployment · Software Architecture and Design Patterns · Cloud Computing and Service-oriented Architecture · Mobile Application Development and Platform · User interface Design and User Experience · Software Project Management and Agile Development · DevOps and Continuous Delivery · Software design method · Software testing technology · Component-based software engineering · Computer-supported collaborative work · Programming language · Multimedia technology application · Embedded software and applications · Computer Graphics and Human Machine Interaction · Computer Aided Design · Cloud-Native and Microservices Architecture · Blockchain and Smart Contracts · Software Security and Vulnerability Remediation · Human-Computer Interaction and User Experience (UX/UI) l Advanced Electronic Materials · Nanomaterials and Nanotechnology · Semiconductor Materials and Devices · Electronic Packaging and Interconnection Technology · Flexible electronics and smart wearable devices · High Frequency Electronic Materials and Applications · Electronic ceramics and catalytic materials · Photoelectric materials and LED technology · Thermoelectric materials and thermal management · technologyBattery Technology and Energy Storage · New display technology and materials · Optoelectronics and Microelectronic Materials · Optoelectronic display materials · Semiconductor Materials and Semiconductor Lighting · Power Laser Materials and Devices · Advanced Packaging Materials and Technologies · Solar cell materials · Electromagnetic Compatibility Technology and Materials · Materials and Devices for High Frequency and Ultra High Frequency Communication
Última actualización por Dou Sun el

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