Conference Information

EEI 2027: International Conference on Electronic Engineering and Informatics

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Submission Date:
2027-04-30 Due in 234 days
Notification Date:
Conference Date:
2027-06-25
Location:
Nanjing, China
Years:
Viewed: 13771   Tracked: 0   Attend: 0

Conference Partner Index (CP-I)

49.4 / 100
Ranked #1,665 of 5,652 conferences · Top 30%

#105 of 507 in Electrical & Electronic Engineering

Academic recognition (35%) No data - scored at the neutral baseline of 50
Submission selectivity (20%) No data - scored at the neutral baseline of 50
Editions held (20%)
62
Community attention (10%)
12
Public record completeness (15%)
55

Inputs used: Editions on record: 9 · Researchers who opened this page in the past 24 months: 4

Missing from the public record: Historical acceptance rates (+4.5) · Best-paper records (+2.3)
Organizers can add these from this page after claiming the conference; scores are recomputed nightly. How to raise this score

Confidence 45% - the share of the score backed by observed data rather than the neutral baseline. How this score is calculated · Browse the ranking · Algorithm version 1.1 · Computed 2026-09-08

Call For Papers

EEI 2027 (International Conference on Electronic Engineering and Informatics) is an academic conference held in Nanjing, China on 2027-06-25. The paper submission deadline is 2027-04-30.

The topics of interest for submission include, but are not limited to: Electronic Technology Control and Application Linear and nonlinear control of electronic systems; Adaptive control and robust control; Stochastic systems and filtering estimation; System identification based on machine learning; Networked control system; Cooperative control of multi-agent systems; Cyber-physical system security and control; Power electronic converter control; Design and optimization of embedded control system; Robot motion control and visual servoing; Application of Digital Signal Processing in Control Electronic Technology 3D process and integration technology; Substrate embedding and advanced flip chip packaging; MEMS and sensor technology; Design and Analysis of Transmission System; New materials, equipment and 3D interconnection; Wearable, flexible and stretchable electronics; Optical interconnection and 3D photonics; Digital system and logic design; Computer architecture and VLSI; Network-driven multi-core chip; Advanced robotic system; Analog and digital electronics; Signals and Systems; Artificial Intelligence and Computational Intelligence Applications; Internet of Things and Sensor Networks Information and Communication Electronic equipment; Satellite and Space Communications; Network and Information Security; Signal processing for wireless communication; Cognitive Radio and Software Radio; Optical networks and systems; Electromagnetic field theory; Antenna, propagation and transmission technology; Optical communication; Radar signal and data processing; Other related topics; Wireless and Mobile Communications; Big Data and Data Mining; Cloud computing and edge computing; Computer Networks and Protocols; Image and Video Processing; Information Theory and Coding
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