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IECC 2026: International Electronics Communication Conference

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IECC
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截稿日期:
2026-08-30
通知日期:
2026-09-30
会议日期:
2026-11-06
会议地点:
Wuhan, China
届数:
浏览: 22246   关注: 5   参加: 1

会伴指数 (CP-I)

50.4 / 100
全站第 1,504 名 / 共 5,682 个会议 · 前 27%

电气与电子工程 第 84 / 509 网络与通信 第 214 / 864

学术认可 (35%) 无数据 —— 按中性基准 50 分计入 —
投稿选择性 (20%) 无数据 —— 按中性基准 50 分计入 —
会议传承 (20%)
59
社区关注 (10%)
28
资料公开度 (15%)
55

用到的输入: 有据可查的届次：8 · 在会伴关注它的研究者：5 人 · 过去 24 个月打开过本页的研究者：3 人

公开资料里还缺: 历年录用率 (+4.5) · 最佳论文记录 (+2.3)
主办方认领本会议后，可直接在这一页补上；分数每晚重算。如何提升这个分数

置信度 45% —— 分数中有多大比例来自实际观测到的数据，而不是中性基准。 这个分数是怎么算出来的 · 查看完整榜单 · 算法版本 1.1 · 算于 2026-09-15

征稿

IECC 2026 (International Electronics Communication Conference) is an academic conference held in Wuhan, China on 2026-11-06. The paper submission deadline is 2026-08-30. Acceptance notifications are sent on 2026-09-30.

IECC will present the most recent and exciting advances in Electronics Communication through keynote talks. Prospective authors are invited to submit papers on relevant topics, but not limited to: 1. Next-Generation Wireless Communications Track Chair: Assoc. Prof. Helin Yang, Xiamen Uiversity, China Reconfigurable Intelligent Surfaces (RIS): programmable wireless environments, channel modeling, phase shift control, and RIS-aided transmission Terahertz Communications: devices, antennas, beamforming, channel characterization, and system integration for 6G Integrated Sensing and Communications (ISAC): joint waveform design, sensing-assisted communication, resource allocation, and performance trade-offs Cell-Free Massive MIMO: architecture, distributed signal processing, fronthaul design, and user-centric clustering Semantic and Goal-Oriented Communications: beyond bit transmission, semantic encoding, task-driven compression, and AI-native protocols Millimeter-wave and Sub-THz systems: propagation modeling, beam management, and hardware impairments 2. Optical Communications and Fiber Networks Space Division Multiplexing: few-mode and multi-core fiber transmission, mode coupling, MIMO-DSP, and spatial channel modeling Coherent Optical Communications: advanced modulation formats, digital signal processing for short-reach and long-haul applications Optical Network Automation: AI/ML-based control, fault prediction, self-optimizing networks, and telemetry Underwater Wireless Optical Communication: channel modeling (turbulence, scattering), link budget, and system design for blue-green wavelengths Elastic Optical Networks: spectrum slicing, dynamic resource allocation, fragmentation management, and SDN-enabled control Free-space optical (FSO) communications: atmospheric turbulence mitigation, acquisition/tracking, and hybrid RF/FSO systems 3. Structured Light and Optical Field Manipulation Orbital Angular Momentum (OAM): generation, multiplexing, demultiplexing, and detection for high-capacity communications Metasurface Wavefront Engineering: compact beam shaping devices, holographic metasurfaces, and programmable metasurfaces Vector Beams and Polarization Control: spatially variant polarization, Poincaré sphere encoding, and applications in communication systems Non-Diffracting Beams: Bessel, Airy, and Mathieu beams: propagation properties and beam recovery in free-space links Propagation of Structured Light in Turbulent Media: adaptive compensation, turbulence-resistant encoding, and channel correction techniques Plasmonic and dielectric nano-antennas for beam steering 4. Optical Sensing: Technologies and Applications Distributed Fiber Optic Sensing: Brillouin, Raman, and Rayleigh scattering techniques for temperature, strain, and vibration monitoring Fiber Bragg Grating (FBG) Sensors: design, multiplexing, and structural health monitoring LiDAR Technologies: solid-state LiDAR, FMCW LiDAR, photon-counting LiDAR for autonomous driving and 3D mapping Photonics Integrated Chip Sensors: on-chip optical sensors for chemical, biological, and physical quantities Surface Plasmon Resonance (SPR) Sensors: real-time label-free detection, biosensing arrays, and portable platforms Optical coherence tomography (OCT) and interferometric sensing 5. Machine Learning and AI in Communications Deep Learning for Physical Layer: channel estimation, equalization, demodulation, and end-to-end learning for transceivers Federated Learning for Edge Communications: privacy-preserving distributed training, model aggregation, and resource-aware learning Graph Neural Networks for Network Routing: topology-aware optimization, flow scheduling, and adaptive routing Generative AI for Network Management: traffic prediction, anomaly detection, and network digital twins Autoencoder-Based End-to-End Communication: joint source-channel coding, learned modulation, and robust representations Reinforcement learning for resource allocation: dynamic spectrum access, power control, and beam selection 6. Communication Signal Processing Advanced Modulation and Coding: OFDM, FBMC, UFMC, LDPC, polar codes, and turbo equalization Adaptive Filtering and Equalization: blind equalization, decision feedback equalizers, and Kalman filtering for time-varying channels MIMO Signal Processing: precoding, detection algorithms (ZF, MMSE, sphere decoding), and massive MIMO reduced-complexity methods Array Signal Processing: DOA estimation (MUSIC, ESPRIT, compressive sensing), beamforming (adaptive, robust), and source localization Nonlinear Distortion Compensation: digital predistortion, memory polynomial models, and neural-network-based linearization Signal Processing for Software-Defined Radio: reconfigurable filter banks, sample-rate conversion, and digital up/down conversion Compressed Sensing and Sparse Recovery for channel estimation and spectrum sensing Real-time DSP implementations on FPGA, GPU, and multi-core architectures 7. Electromagnetic Theory and Technologies Computational Electromagnetics: FDTD, FEM, MoM, integral equation methods for antenna and scattering problems RF/Microwave Circuits and Systems: LNA, mixer, VCO, power amplifiers, filters, and passive components (couplers, dividers) Antenna Theory and Design: phased arrays, reflectarrays, lens antennas, MIMO antennas, and millimeter-wave antenna-in-package Electromagnetic Compatibility and Interference (EMC/EMI): shielding, grounding, crosstalk mitigation, and system-level modeling Metamaterials and Metasurfaces: negative-index materials, cloaking, perfect absorbers, and tunable electromagnetic surfaces Millimeter-wave and Terahertz Electromagnetics: propagation, scattering, and material characterization High-Power Electromagnetic (HPEM) Effects and protection techniques Electromagnetic Inverse Problems for imaging and non-destructive testing 8. Advanced Microelectronic Systems and Components Track Chair: Prof. Dr.T.Nandha Kumar, University of Nottingham Malaysia, Malaysia (Senior Member IEEE, Fellow HEA(UK), MIET) RF MEMS and Tunable Components: switches, varactors, resonators, and phase shifters for reconfigurable front-ends Monolithic Microwave Integrated Circuits (MMIC) for communication transceivers (GaN, GaAs, SiGe) System-in-Package (SiP) and Heterogeneous Integration: 3D integration, interposers, and chiplet-based RF modules High-Speed Mixed-Signal Circuits: data converters (ADC/DAC) for wideband communication, jitter analysis, and calibration Power Amplifier Efficiency Enhancement Techniques: Doherty, envelope tracking, outphasing, and digital predistortion Frequency Synthesizers and Clocking: PLLs, DDS, fractional-N synthesizers for mm-wave and sub-THz bands Antenna-in-Package (AiP) and Module Design for 5G/6G terminals and base stations Reliability and Thermal Management of microsystems for communication infrastructure
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