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AMA 2019: International Conference on Advanced Materials and Applications

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마감 카운트다운 배지 삽입
AMA
투고 마감일:
2019-02-13 Extended
통보일:
2019-04-20
개최일:
2019-04-10
개최지:
Ningbo, China
개최 횟수:
4
조회: 22350   팔로우: 0   참가: 1

논문 모집

AMA 2019 (International Conference on Advanced Materials and Applications) is an academic conference held in Ningbo, China on 2019-04-10. The paper submission deadline is 2019-02-13 (extended). Acceptance notifications are sent on 2019-04-20.

AMA 2019 is dedicated to cutting edge research that addresses scientific needs of academic researchers and industrial professionals to explore new horizons of knowledge related to Advanced Materials and Applications. AMA 2019 is scheduled to include high-quality paper presentation sessions revealing the latest research findings, and to engage participants in interesting discussion sessions. We seek novel paper submissions to be presented or posted (as a poster paper) in AMA 2019 with topics broadly including, but not limited to : Functional Materials (Energy, Environment, Electronic, Optical, Magnetic and Spintronic) Structural Materials (Metal, Ceramics, Polymer) Composites Nano materials Biomaterials and Healthcare Surface Science and Technology (including tribology, fatigue and corrosion) Materials Modeling and Simulation Materials Characterization Advanced Manufacturing Technologies Nanotechnologies (Nanobiology, Nanotribology, Nanoelectronics, Nanomagnetics, Nanoenergy, NEMS/MEMS) Other related topics
최종 수정: Richert Kevin ()

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관련 저널

CCF정식 명칭영향력 지수출판사ISSN
AIEEE Transactions on Multimedia9.7IEEE1520-9210
CKnowledge-Based Systems7.2Elsevier0950-7051
BSoftware & Systems Modeling3.2Springer1619-1366
AIEEE Transactions on Computers3.8IEEE0018-9340
CFuture Generation Computer Systems6.1Elsevier0167-739X
CNeurocomputing6.5Elsevier0925-2312
CPattern Recognition Letters3.9Elsevier0167-8655
BPattern Recognition7.6Elsevier0031-3203
IEEE Access3.6IEEE2169-3536
AIEEE Transactions on Dependable and Secure Computing7.5IEEE1545-5971

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