학회 정보

ISMST 2018: International Symposium on Material Science and Technology

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투고 마감일:
2018-04-28 Extended
통보일:
2018-05-02
개최일:
2018-03-29
개최지:
Chengdu, China
개최 횟수:
3
조회: 12903   팔로우: 0   참가: 0

논문 모집

ISMST 2018 (International Symposium on Material Science and Technology) is an academic conference held in Chengdu, China on 2018-03-29. The paper submission deadline is 2018-04-28 (extended). Acceptance notifications are sent on 2018-05-02.

2018 International Conference on Advanced Functional Materials and Composites(ICAFMC2018) Session Description 2018 International Conference on Advanced Functional Materials and Composites(ICAFMC2018) will be held on September 5-7, 2018 in Barcelona, Spain. The main objective of ICAMEM2018 is to provide a platform for academics, researchers, engineers, consultants and companies from all over the world. Warmly welcome the experts and scholars engaged in research on related technologies and professional and technical personnel to contribute and participate in the conference. ●Venue: Barcelona, Spain ●Conferences Date: September 5-7, 2018 ●Meeting web: http://www.icafmc.org/ The paper publication All the accepted papers will be published by the journal of "MATEC Web of Conferences"(ISSN Online: 2261-236X) that is contained the Ei Source List. The papers will be submitted to ISTP (CPCI-S), Google Scholar, CAS, Compendex, Inspec, DOAJ and Scopus Conference Theme T1: Materials processing and handling T2: Engineering Materials Research T3: Mechanical behavior and fracture T4: Polymer matrix composites Important Dates Submission Deadline: June 30, 2018 Notification Date: July 6, 2018 Registration Deadline: July 13, 2018 Conference Date: September 5-7, 2018 Paper Submission 1. Submit by CMT system: 2. Email: [email protected] Contact Us Email: [email protected] wechat:13125407442 Tel:+86-24-83958379-809 Miss Wang
최종 수정: Hua Hua ()

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BSoftware & Systems Modeling3.2Springer1619-1366
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CFuture Generation Computer Systems6.1Elsevier0167-739X
CNeurocomputing6.5Elsevier0925-2312
CPattern Recognition Letters3.9Elsevier0167-8655
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