Información de la conferencia
AWMM 2020: Asia Workshop on Modeling and Mechatronics
http://www.apmie.org/AWMM/awmm.htmlDía de Entrega: |
2020-09-20 Extended |
Fecha de Notificación: |
2020-10-05 |
Fecha de Conferencia: |
2020-10-23 |
Ubicación: |
Shenzhen, China |
Vistas: 8989 Seguidores: 0 Asistentes: 1
Solicitud de Artículos
AWMM 2020 was cancelled
Última Actualización Por Max Chen en 2020-08-31
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Abreviación | Nombre Completo | Entrega | Conferencia |
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ISNN | International Symposium on Neural Networks | 2020-05-01 | 2020-10-01 |
IComputation | IEEE Symposium on Immune Computation | 2019-07-10 | 2019-12-06 |
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i3D | ACM SIGGRAPH Symposium on Interactive 3D Graphics and Games | 2021-12-22 | 2022-05-03 |
RACE | Asia-Pacific Conference on Robotics, Automation and Communication Engineering | 2020-05-30 | 2021-07-20 |
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Revistas Relacionadas
CCF | Nombre Completo | Factor de Impacto | Editor | ISSN |
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Microelectronic Engineering | 2.523 | Elsevier | 0167-9317 | |
IEEE/ASME Transactions on Mechatronics | 4.943 | IEEE | 1083-4435 | |
Applied Computational Intelligence and Soft Computing | Hindawi | 1687-9724 | ||
Journal of Systems Engineering and Electronics | Beijing Institute of Aerospace Information | 1004-4132 | ||
Advances in Power Electronics | Hindawi | 2090-181X | ||
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Chinese Journal of Electronics | CIE | 1022-4653 | ||
International Journal on Organic Electronics | AIRCC | 2319-4359 | ||
Computational Mathematics and Modeling | Springer | 1046-283X | ||
International Biomechanics | Taylor & Francis | 2333-5432 |
Nombre Completo | Factor de Impacto | Editor |
---|---|---|
Microelectronic Engineering | 2.523 | Elsevier |
IEEE/ASME Transactions on Mechatronics | 4.943 | IEEE |
Applied Computational Intelligence and Soft Computing | Hindawi | |
Journal of Systems Engineering and Electronics | Beijing Institute of Aerospace Information | |
Advances in Power Electronics | Hindawi | |
Electronics | 2.412 | MDPI |
Chinese Journal of Electronics | CIE | |
International Journal on Organic Electronics | AIRCC | |
Computational Mathematics and Modeling | Springer | |
International Biomechanics | Taylor & Francis |
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