Conference Information
ICESS 2019: International Conference on Embedded Software and Systems
http://lcs.ios.ac.cn/icess2019/
Submission Date:
2019-03-12
Notification Date:
2019-04-02
Conference Date:
2019-06-02
Location:
Las Vegas, Nevada, USA
Years:
15
CORE: c   Viewed: 7853   Tracked: 2   Attend: 1

Conference Location
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Call For Papers
Overview

The advancement of embedded software and systems, such as intelligent vehicles, industrial robots, wearable devices, and Internet-of-Things, has great societal and economic impacts. It is of utmost importance to ensure the safety, efficiency, and security of their design and implementation. The IEEE International Conference on Embedded Software and Systems (ICESS) is a global forum for researchers and developers from academia, industry, and government to present and discuss emerging ideas and trends in embedded software and systems. The conference has a broad scope covering the design, implementation, optimization, and validation of embedded software and systems in various domains, with recent focus on cyber-physical systems, Internet-of-Things, embedded security, and autonomous software systems.

ICESS 2019 is the 15th IEEE International Conference on Embedded Software and Systems. The conference will be collocated with the Design Automation Conference (DAC) 2019 in Las Vegas, Nevada, USA. Participants can access DAC exhibits, keynotes, and receptions. It is the next event of a series of highly successful international conferences, held in recent years as ICESS 2017 (Sydney, Australia), ICESS 2016 (Sichuan, China), ICESS 2015 (New York, USA), ICESS 2014 (Paris, France), ICESS 2013 (Sydney, Australia), ICESS 2012 (Liverpool, UK), ICESS 2011 (Changsha, China), and ICESS 2010 (Bradford, UK).

All accepted papers are expected to be included in IEEE Xplore and indexed by EI. Selected papers, after further revisions, will be considered for publication in a special issue of the Elsevier Journal of Systems Architecture. ICESS 2019 will be sponsored by the IEEE, the IEEE Computer Society, the IEEE Technical Committee on Scalable Computing (TCSC), and the IEEE Technical Committee on Cyber-Physical Systems (TCCPS), pending approval.

Conference Scope

Topics of interest include, but are not limited to:

Systems, Models and Algorithms Track

    Embedded System Architecture
    Embedded Software Architectures
    Embedded OS, Scheduling and Runtime Support
    Embedded Storage and I/O Systems
    Real-Time Embedded Systems
    Distributed and Networked Embedded Systems
    Fault Tolerant and Trusted Embedded Systems
    Mixed-Criticality Embedded Systems
    Heterogeneous SoC and Multicore Embedded Systems
    Power and Thermal Aware Computing
    Reconfigurable Embedded Computing

Design Methodology and Tools Track

    Design Technologies of Embedded Systems
    Formal Methods for Embedded Systems
    Middleware for Embedded Systems
    IDE and Software Tools
    Hardware/Software Co-Design
    Component-Based Embedded Software Design
    Model-based Design for Embedded Software
    Domain/Application-Specific Design Techniques
    Testing Techniques for Embedded Software/Systems
    Verification and Validation for Embedded Systems
    Compilation and Debug Techniques and Tools
    Performance Evaluation Techniques and Tools
    Safety of Machine Learning for Embedded Systems

Emerging Embedded Applications and Interdisciplinary Topics Track

    Intelligent Embedded Systems
    Machine Learning for Embedded Applications
    Internet-of-Things (IoT)
    Wearable Computing
    Smart City
    Robotics and Control Systems
    Wireless Sensor Networks
    Cyber-Physical Systems
    Assured Autonomy for Safety-Critical CPS
    Automotive and Avionics Systems
    Medical Systems
    Database & Multimedia Systems
    Network Protocols and Security
    Emergency and Disaster Management Consumer Electronics
    Mobile Cloud Computing
    Industrial Practices and Case Studies

Guidelines for Manuscripts

Submissions should contain significant novel ideas and technical results that have not been published or concurrently submitted to any other venue. Submitted manuscripts should be written in English conforming to the IEEE conference proceedings format (8.5” x 11” page size, two-column). All paper submissions must represent original and unpublished work. Papers must be submitted as PDF files through EasyChair website: https://easychair.org/conferences/?conf=icess2019.

Papers should not be longer than 8 pages in the IEEE conference format. Some papers may be accepted after review as short papers; the camera-ready versions of such papers should normally not exceed 4 pages. Authors of accepted papers (regular-length or short papers) will have the option to pay for up to 2 extra pages at the time of registration.
Last updated by Dou Sun in 2019-02-27
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