会议信息
LTB-3D 2012: International Workshop on Low Temperature Bonding for 3D Integration
http://www.su.t.u-tokyo.ac.jp/~3dwb/截稿日期: |
Extended |
通知日期: |
|
会议日期: |
2012-05-22 |
会议地点: |
Hongo, Japan |
届数: |
3 |
浏览: 11571 关注: 0 参加: 0
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| CEAC | International Civil Engineering and Architecture Conference | 2024-01-15 | 2024-03-15 |
| OWLED | International Workshop on OWL: Experiences and Directions | 2012-05-27 | |
| ICME | International Conference on Multimedia and Expo | 2023-12-15 | 2024-07-15 |
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相关期刊
| CCF | 全称 | 影响因子 | 出版商 | ISSN |
|---|---|---|---|---|
| Flow Measurement and Instrumentation | 2.037 | Elsevier | 0955-5986 | |
| International Journal of Child-Computer Interaction | Elsevier | 2212-8689 | ||
| c | Data Science and Engineering | Springer | 2364-1185 | |
| b | International Journal of Human-Computer Interaction | 1.26 | Taylor & Francis | 1044-7318 |
| b | Human–Computer Interaction | Taylor & Francis | 0737-0024 | |
| International Journal of Computer Networking and Communication | AR Publication | 2347-4149 | ||
| Computing and Informatics | Institute of Informatics, Slovakia | 1335-9150 | ||
| b | User Modeling and User-Adapted Interaction | 4.412 | Springer | 0924-1868 |
| Journal of Logic, Language and Information | Springer | 0925-8531 | ||
| International Journal of Document Analysis and Recognition | 0.405 | Springer | 1433-2833 |
| 全称 | 影响因子 | 出版商 |
|---|---|---|
| Flow Measurement and Instrumentation | 2.037 | Elsevier |
| International Journal of Child-Computer Interaction | Elsevier | |
| Data Science and Engineering | Springer | |
| International Journal of Human-Computer Interaction | 1.26 | Taylor & Francis |
| Human–Computer Interaction | Taylor & Francis | |
| International Journal of Computer Networking and Communication | AR Publication | |
| Computing and Informatics | Institute of Informatics, Slovakia | |
| User Modeling and User-Adapted Interaction | 4.412 | Springer |
| Journal of Logic, Language and Information | Springer | |
| International Journal of Document Analysis and Recognition | 0.405 | Springer |
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