# JETTA — Journal of Electronic Testing: Theory and Applications

- **Publisher**: Springer
- **ISSN**: 0923-8174
- **Impact factor**: 1.3
- **CCF rank**: C
- **Trackers**: 2
- **Canonical page**: https://www.myhuiban.com/journal/688

## Call for papers

Aims and scope The Journal of Electronic Testing: Theory and Applications is an international forum for the dissemination of research and application information in the area of electronic testing. This is the only journal devoted specifically to electronic testing. The papers for publication in Journal of Electronic Testing: Theory and Applications are selected through a peer review to ensure originality, timeliness, and relevance. The journal provides archival material, and through its quick publication cycle, strives to bring recent results to researchers and practitioners. While it emphasizes publication of preciously unpublished material, conference papers of exceptional merit that require wider exposure are, at the discretion of the editors, also published provided they meet the journal's peer review standard. Journal of Electronic Testing: Theory and Applications also seeks clearly written survey and review articles to promote improved understanding of the state of the art. Journal of Electronic Testing: Theory and Applications coverage includes, but is not limited to the following topics: Testing of VLSI devices printed circuit boards, and electronic systems; Testing of analog and digital electronic circuits; Testing of microprocessors, memories, and signal processing devices; Fault modeling; Test generation; Fault simulation; Testability analysis; Design for testability; Synthesis for testability; Built-in self-test; Test specification; Fault tolerance; Formal verification of hardware; Simulation for verification; Design debugging; AI methods and expert systems for test and diagnosis; Automatic test equipment (ATE); Test fixtures; Electron Beam Test Systems; Test programming; Test data analysis; Economics of testing; Quality and reliability; CAD Tools; Testing of wafer-scale integration devices; Testing of reliable systems; Manufac turing yield and design for yield improvement; Failure mode analysis and process improvement

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Source: Conference Partner — https://www.myhuiban.com/journal/688 (rankings reproduced from CCF / ICORE / QUALIS; data cached up to 1 hour)