# AI & Materials

- **Publisher**: ELSP
- **ISSN**: 3006-7588
- **Trackers**: 0
- **Canonical page**: https://www.myhuiban.com/journal/1201

## Special issues

| Title | Submission deadline |
|---|---|
| AI-Enhanced Multifunctional Dielectric Materials — From Design to Application | 2026-06-30 |
| Intelligent Additive Manufacturing | 2026-03-01 |

## Call for papers

AI & Materials is an online multidisciplinary open access journal committed to the deep integration and common enhancement in materials science and artificial intelligence (AI) technology. The journal aims to build an open and fair platform to attract peer-reviewed research articles that report newest achievements with innovation related to joint developments of AI theory and technology and materials design, prediction and production. Moreover, the journal also welcomes the novel research papers that potentially motivate the Interdisciplinary progresses of materials science and AI. The scope of the journal includes but is not limited to: Novel AI algorithms that have potential applications to materials Computer-aided design of novel materials AI for science technique, especially for materials science Digital twin technology with AI for materials industry Modelling techniques for manufacturing processes and systems boosted with AI Materials theory assisted by AI technology High-Performance Computing (HPC) for modeling, simulation, and analysis applicable to materials and AI

## Related conferences

- AI+E — International Conference on AI & Engineering — https://www.myhuiban.com/conference/5399
- AI' — International Conference on Artificial Intelligence and Applications — https://www.myhuiban.com/conference/3462
- Materials Asia — International Conference on Materials Science and Engineering — https://www.myhuiban.com/conference/3536
- AI-SS — International Workshop on AI Safety and Security — https://www.myhuiban.com/conference/5398
- AI-SIIS — IEEE International Conference on AI and Security for Industrial IoT Systems — https://www.myhuiban.com/conference/5288

## Related journals

- AI+ — https://www.myhuiban.com/journal/1203
- Blockchain — https://www.myhuiban.com/journal/1205
- Advanced Information and Communication — https://www.myhuiban.com/journal/1204
- Mechatronics Technology — https://www.myhuiban.com/journal/1209
- Biofunctional Materials — https://www.myhuiban.com/journal/1207

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Source: Conference Partner — https://www.myhuiban.com/journal/1201 (rankings reproduced from CCF / ICORE / QUALIS; data cached up to 1 hour)