# Materials Science in Semiconductor Processing

- **Publisher**: Elsevier
- **ISSN**: 1369-8001
- **Impact factor**: 4.6
- **Trackers**: 0
- **Canonical page**: https://www.myhuiban.com/journal/1199

## Special issues

| Title | Submission deadline |
|---|---|
| Emerging Two-Dimensional Semiconductor Materials for Electronic and Optoelectronic Applications | 2027-03-31 |
| Advanced Packaging Techniques for Electronics and Optoelectronics | 2026-12-31 |
| Advanced Electronic Packaging and Heterogenous Integration for Future Artificial Intelligence Applications | 2026-11-01 |
| Magnetic and Multiferroic Semiconductors: Processing, Characterization, and Emerging Applications | 2026-06-30 |
| 21st International Conference on Gettering and Defect Engineering in Semiconductor Technology (GADEST 2026) | 2026-05-31 |
| Control of Semiconductor Interfaces and Group-IV Semiconductor Engineering Technologies (ISCSI-X & ICSI/ISTDM 2025) | 2026-03-31 |
| Defects in Semiconductors for Quantum Information Quantum defects | 2026-01-31 |
| Nitride and Related Materials for Electronic and Optoelectronic Applications | 2026-01-31 |

## Call for papers

Functional Materials for (Opto)electronics, Sensors, Detectors, and Green Energy. Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications, and theoretical studies of functional semiconductor materials and devices. Each issue aims to provide a snapshot of current insights, new achievements, breakthroughs, perspectives, and future trends in material sciences for such diverse fields as advanced electronics and opto-electronics, sensors and detectors, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film deposition and growth technology, hybrid and quantum materials, device fabrication technology, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography, etching, doping, annealing, and thin film processing for submicron and nano devices; material and device failure, reliability, damage evolution, and related issues; advanced chemical and physical vapor deposition; advanced metallization and interconnect schemes; compound semiconductor materials and processing; new dielectrics and non-oxide materials and their applications; (macro)molecular, hybrid, heterostructure, and quantum materials, devices, and processing; molecular dynamics, ab-initio methods, Monte Carlo simulations, data intensive and machine-learning based approaches, etc.; new materials and processes for discrete and integrated circuits; advanced electronic packaging materials and processes; magnetic materials and spintronics; crystal growth technology and mechanism; intrinsic impurities and defects of materials. Pure device simulation and modelling without connection to experiment is not within the aim and scope of this journal.

## Related conferences

- Materials Asia — International Conference on Materials Science and Engineering — https://www.myhuiban.com/conference/3536
- ISSET — International Symposium on Semiconductor and Electronic Technology — https://www.myhuiban.com/conference/4599
- ISPSD — International Symposium on Power Semiconductor Devices and ICs — https://www.myhuiban.com/conference/4733
- BCICTS — IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium — https://www.myhuiban.com/conference/5278
- GMMPA — International Conference on Green Materials, Materials Processing and Applications — https://www.myhuiban.com/conference/2674

## Related journals

- Materials Science and Engineering: B — https://www.myhuiban.com/journal/1193
- Materials Science and Engineering: C — https://www.myhuiban.com/journal/409
- Computational Materials Science — https://www.myhuiban.com/journal/805
- Journal of Materials Processing Technology — https://www.myhuiban.com/journal/742
- Materials & Design — https://www.myhuiban.com/journal/1057

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Source: Conference Partner — https://www.myhuiban.com/journal/1199 (rankings reproduced from CCF / ICORE / QUALIS; data cached up to 1 hour)