# SLIP — International Workshop on System Level Interconnect Prediction

- **Submission deadline**: 2019-03-22
- **Notification date**: 2019-04-07
- **Conference date**: 2019-06-02
- **Location**: Las Vegas, Nevada, USA
- **Trackers**: 0
- **Attendees**: 0
- **Canonical page**: https://www.myhuiban.com/conference/879

## Call for papers

Technical topics include but are not limited to: Learning and predictive models for optimizing interconnect at various IC and system design stages System-level design for FPGAs, NoCs, reconfigurable systems Design, analysis, and (co)optimization of power and clock networks Topologies and fabrics of multi- and many-core architectures Power consumption of interconnects System level reliability, aging, and thermal issues Security-aware power/clock delivery and interconnect design Design-for-manufacturing (DFM) and yield techniques for interconnects High speed chip-to-chip interconnect Design and analysis of chip-package interfaces 3D interconnect design and prediction Applications of interconnects to social, genetic, and biologicalsystems Emerging interconnect technologies in machine learning platforms & chips

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