# SenSys — ACM/IEEE Conference on Embedded Artificial Intelligence and Sensing Systems

- **Submission deadline**: 2026-05-29
- **Notification date**: 2026-08-31
- **Conference date**: 2027-05-11
- **Location**: New York City, New York, USA
- **Rankings**: CCF B · QUALIS A1
- **Conference Partner Index**: 92.7/100 (ranked #33, confidence 1.00, algorithm 1.1) — how this is computed: https://www.myhuiban.com/ranking
- **Trackers**: 90
- **Attendees**: 12
- **Canonical page**: https://www.myhuiban.com/conference/61

## Acceptance history

| Year | Submitted | Accepted | Rate |
|---|---|---|---|
| 2017 | 151 | 26 | 17.2% |
| 2011 | 123 | 24 | 19.5% |
| 2010 | 145 | 25 | 17.2% |
| 2009 | 119 | 21 | 17.6% |
| 2008 | 153 | 25 | 16.3% |
| 2007 | 149 | 25 | 16.8% |
| 2006 | 122 | 24 | 19.7% |
| 2005 | 118 | 21 | 17.8% |
| 2004 | 145 | 21 | 14.5% |
| 2003 | 137 | 24 | 17.5% |

## Past editions

| Year | Deadline | Conference date | Location |
|---|---|---|---|
| 2026 | 2025-11-06 | 2026-05-11 | Saint-Malo, France |

## Call for papers

We are pleased to announce SenSys 2027: The International Conference on Embedded Artificial Intelligence and Sensing Systems, co-located with CPS-IoT Week. In 2026, SenSys, IPSN, and IoTDI merged into a single flagship conference, uniting their communities to create the premier forum for research on sensing systems and embedded artificial intelligence (AI). The combined event brings together expertise across sensor networks, embedded systems, mobile and wireless computing, machine learning, cyber-physical systems (CPS), Internet of Things (IoT), and AI-driven applications—fostering new directions and cross-disciplinary impact. SenSys 2027 will continue this tradition. Accepted regular papers will be published with ACM; accepted demo and poster abstracts will be published with IEEE. All content will be cross-indexed. Topics of Interest SenSys 2027 welcomes submissions on original, high-impact research across embedded AI, sensing systems, and CPS/IoT. Topics include, but are not limited to: Algorithms and Information Analytical and theoretical foundations for embedded sensing systems Coding, compression, and information theory for embedded systems Collaborative sensing with AI/ML-driven models Federated learning or neural architecture search (NAS) Large language models for edge and embedded systems Processing in sensor networks and embedded systems Applications Augmented and virtual reality Autonomous vehicles, unmanned aerial vehicles, and drones Personal, wearable, and other human-centric embedded systems Smart cities, smart buildings, and industrial IoT Platforms Low-power and novel IoT protocols for 5G/6G and other architectures New communication paradigms for ubiquitous connectivity Satellite systems and applications, including CubeSats Systems for extreme environments (e.g., underwater, aerial, space) Security Decentralization and blockchain for embedded sensing systems Fairness, equity, and transparency issues in IoT and CPS Fault-tolerance, dependability, and robustness in embedded platforms IoT data marketplaces, compression, and semantic summarization Secure and privacy-sensitive IoT Systems Digital twins and physical AI systems for real-world applications Edge computing, fog computing, and real-time IoT/CPS systems Heterogeneous sensor networks and data fusion IoT and CPS for sustainability Localization, synchronization, RFID, and RF sensing Novel sensor technologies, sensing paradigms, and deployments In addition, SenSys 2027 will accept submissions as a full or short paper on Visions, Experiences, Tools, Datasets, and Benchmarks: Visions, grand challenges, or new directions Experiences, insights, challenges, and lessons learned from real-world deployments Benchmarks for evaluating systems, models, algorithms, or tools Tools, toolkits, or frameworks that advance research in embedded AI and sensing systems Datasets that support research in embedded AI and sensing systems Frameworks that advance research in embedded AI and sensing systems Authors submitting to the second category on visions, experiences, etc., may choose between a full paper (12 pages) or a short paper (6 pages). Short papers will be evaluated on originality, clarity, and potential impact, even without extensive evaluation. Note that survey and tutorial papers are out of scope for SenSys 2027. All accepted papers will be presented at the conference, and their presentation format will be determined later.

## Related conferences

- Artificial Intelligence — International Conference on Automation and Artificial Intelligence — https://www.myhuiban.com/conference/3369
- ICRA — International Conference on Robotics and Automation — https://www.myhuiban.com/conference/421
- IJCAI — International Joint Conference on Artificial Intelligence — https://www.myhuiban.com/conference/405
- ICASSP — International Conference on Acoustics, Speech and Signal Processing — https://www.myhuiban.com/conference/429
- PODS — ACM SIGMOD Conference on Principles of DB Systems — https://www.myhuiban.com/conference/138

## Related journals

- Sensing and Bio-Sensing Research — https://www.myhuiban.com/journal/803
- Design Automation for Embedded Systems — https://www.myhuiban.com/journal/34
- Software & Systems Modeling — https://www.myhuiban.com/journal/99
- Pattern Recognition — https://www.myhuiban.com/journal/198
- IEEE Transactions on Neural Networks and Learning Systems — https://www.myhuiban.com/journal/188

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Source: Conference Partner — https://www.myhuiban.com/conference/61 (rankings reproduced from CCF / ICORE / QUALIS; data cached up to 1 hour)