# 3EAI — International Conference on Electrical and Electronics Engineering and Artificial Intelligence

- **Submission deadline**: 2026-10-23
- **Notification date**: 2026-10-30
- **Conference date**: 2026-11-06
- **Location**: Tumxuk, China
- **Conference Partner Index**: 37.3/100 (ranked #5546, confidence 0.45, algorithm 1.1) — how this is computed: https://www.myhuiban.com/ranking
- **Trackers**: 0
- **Attendees**: 0
- **Canonical page**: https://www.myhuiban.com/conference/5852

## Call for papers

2026 International Conference on Electrical and Electronics Engineering and Artificial Intelligence (3EAI 2026) will be held grandly in Tumxuk,Xinjiang, China on November 6-8, 2026. The 2026 International Conference on Electrical and Electronics Engineering and Artificial Intelligence (3EAI 2026) aims to bring together global experts, scholars, and researchers to discuss the latest advancements and technical applications in the fields of Electrical Engineering, Electronics, and Artificial Intelligence. Focusing on cutting-edge theories and core technologies, the conference provides a high-level academic exchange platform to foster interdisciplinary collaboration and innovative development. We warmly welcome scholars from around the world to submit papers and participate in this academic event. PUBLICATION All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in the Conference Proceedings by IEEE, and submitted to IEEE xplore, EI Compendex, Scopus for indexing. CALL FOR PAPERS Topics of interests are in the broad areas of Electrical and Electronics Engineering and Artificial Intelligence, including but not limited to: · Electrical Engineering Power Systems and Automation Smart Grid and Microgrid Technologies High Voltage and Insulation Technology Power Electronics and Drive Control Electrical Machines and Devices Optimization Power Quality and Electromagnetic Compatibility Renewable Energy Generation and Grid Integration Battery Management Systems and Energy Storage …… Electronic Engineering Circuits and Systems Design Very Large Scale Integration (VLSI) Embedded Systems and Internet of Things Communications and Wireless Networks Signal and Image Processing Microwave Technology and Antenna Design Optoelectronics and Laser Technology Semiconductor Devices and Sensor Technology …… Artificial Intelligence Machine Learning and Deep Learning Computer Vision and Pattern Recognition Natural Language Processing and Understanding Intelligent Control and Robotics Data Mining and Knowledge Discovery Fuzzy Systems and Evolutionary Algorithms Multi-Agent Systems Explainable AI and Large Language Models …… Interdisciplinary and Emerging Topics AI Applications in Electrical and Electronic Systems Industry 4.0 and Intelligent Manufacturing Digital Twins and Cyber-Physical Systems (CPS) Intelligent Fault Diagnosis and Predictive Maintenance Autonomous Driving and Intelligent Transportation Edge AI and Embedded Intelligent Systems ……

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Source: Conference Partner — https://www.myhuiban.com/conference/5852 (rankings reproduced from CCF / ICORE / QUALIS; data cached up to 1 hour)
