# IWIPP — IEEE International Workshop on Integrated Power Packaging - **Submission deadline**: 2026-10-09 - **Notification date**: 2026-11-26 - **Conference date**: 2027-02-28 - **Location**: Kitakyushu, Japan - **Trackers**: 0 - **Attendees**: 0 - **Canonical page**: https://www.myhuiban.com/conference/5813 ## Call for papers Background The first IWIPP was held in 1998 at the Congress Plaza Hotel in Chicago, IL, USA. After the 2000 edition in Waltham, MA, IWIPP went on a 15-year hiatus and returned to its Chicago roots in 2015. The 2015 revival of IWIPP in Chicago was an exciting workshop which focused on cutting-edge packaging approaches. After the success of IWIPP 2017, 2019 and 2022 in Europe, IWIPP returned to the United States in 2025 and was hosted in Tuscaloosa, Alabama. The next IWIPP is scheduled to be held in the spring of 2027 in Kitakyushu, Japan, marking its first edition in Asia-Pacific. The purpose of this workshop is to bring together researchers in the field of power electronic components, electrical insulating materials, and packaging technologies to promote the development and commercialization of high-density and high-efficiency power converters. Papers are sought that address important challenges in power electronic components and systems and present solutions to increase reliability and manufacturability while targeting increased performance and reduced system cost. The workshop aims to provide the opportunity to engage in a meaningful discussion about the latest technologies and techniques in both industry and academia, and from early-stage research to volume manufacturing, ensuring that a learning environment is fostered for all. IWIPP Technical Expertise Areas Packaging Powerful devices require thoughtful packaging designs. IWIPP covers everything from mechanical and thermal considerations to new low-inductance footprints. System Design From EMI to thermal management and partial discharge, we understand that making great parts work together can be difficult. Dielectrics & Materials It isn’t possible to make great applications without the fundamental dielectrics & materials. Reliability & Testing Once you make a system, you need to put it to the test. And we want to hear how it went. Safety & Standards It can be difficult to protect and benchmark new technology, so we want to hear your thoughts. Optimization Making systems run efficiently and powerfully is a little different than just making them run. Modeling & Simulation Proof-of-concept is critical in electronics design, and virtual prototyping is becoming more powerful each and every day. Devices The heartbeat of power electronics systems. Let’s debate and discuss the best and the latest. ## Related conferences - SIGIR — International Conference on Research and Development in Information Retrieval — https://www.myhuiban.com/conference/141 - AAAI — AAAI Conference on Artificial Intelligence — https://www.myhuiban.com/conference/408 - CVPR — IEEE Conference on Computer Vision and Pattern Recognition — https://www.myhuiban.com/conference/407 - ICRA — International Conference on Robotics and Automation — https://www.myhuiban.com/conference/421 - IJCAI — International Joint Conference on Artificial Intelligence — https://www.myhuiban.com/conference/405 ## Related journals - IEEE Transactions on Power Systems — https://www.myhuiban.com/journal/1129 - Robotics and Computer-Integrated Manufacturing — https://www.myhuiban.com/journal/734 - IEEE Transactions on Multimedia — https://www.myhuiban.com/journal/152 - Knowledge-Based Systems — https://www.myhuiban.com/journal/227 - Software & Systems Modeling — https://www.myhuiban.com/journal/99 --- Source: Conference Partner — https://www.myhuiban.com/conference/5813 (rankings reproduced from CCF / ICORE / QUALIS; data cached up to 1 hour)