# Pan Pac — Pan Pacific Strategic Electronics Symposium

- **Submission deadline**: 2026-11-15
- **Conference date**: 2027-01-25
- **Location**: Maui, Hawaii, USA
- **Trackers**: 0
- **Attendees**: 0
- **Canonical page**: https://www.myhuiban.com/conference/5794

## Call for papers

Core Technical Tracks Advanced Packaging & Processes Heterogeneous Integration, Interposer Technologies, and Nanotechnology Applications. Materials & Reliability Cleaning Technologies, Next-Gen Materials, Inspection, and Failure Analysis Testing. Automotive & High-Reliability Systems Hardware optimization for extreme thermal environments and mission-critical applications. Industry Trends & Roadmaps Global electronics manufacturing drivers, supply chain evolution, and commercial market drivers.

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Source: Conference Partner — https://www.myhuiban.com/conference/5794 (rankings reproduced from CCF / ICORE / QUALIS; data cached up to 1 hour)