# AICsE — International Conference on AI Chips, Integrated Circuits and Electronics

- **Submission deadline**: 2026-07-24
- **Notification date**: 2026-08-24
- **Conference date**: 2026-09-18
- **Location**: Taiyuan, China
- **Conference Partner Index**: 43.6/100 (ranked #3445, confidence 0.25, algorithm 1.1) — how this is computed: https://www.myhuiban.com/ranking
- **Trackers**: 0
- **Attendees**: 0
- **Canonical page**: https://www.myhuiban.com/conference/5622

## Call for papers

2026 International Conference on AI Chips, Integrated Circuits and Electronics (AICsE 2026) aims to promote the exchange of ideas in Electronics, Chips, Integrated Circuits and it's applications. We warmly welcome submission of original unpublished work in following areas: Track 1 : AI Chips Micro and Nano-electronics Design of Integrated Flexible Electronics Testing and Evaluating of Chips Materials for Chips Edge AI and Embedded AI Chips Memory and Storage Architectures for AI Chips Neural Processing Units (NPUs) and AI Accelerators Advanced Fabrication and Packaging Technologies Security and Trusted AI Computing Design Automation and EDA Tools for AI Chips Photonic AI Accelerators and Co-processors Optoelectronic In-memory Computing for AI Optical Interconnects for Chiplet-based AI Systems Optical Neural Networks and Photonic Tensor Processors Co-packaged Optics (CPO) for AI Clusters Neuromorphic Photonic Computing Chips Track 2 : Integrated Circuits RF/mm-Wave Circuits and Systems Digital Circuits Communication SoCs Nonlinear Signal Processing Circuits Sensor Interface Circuits Wireless Transceivers Sensor Interfaces & MEMS Integration EDA, CAD & Formal Verification EDA Biomedical Circuits Systems, and Applications Bio-inspired Circuits Implantable and/or Wearable Systems Analog Circuits and Techniques Hardware Security & Trust Integrated Silicon Photonic Transceivers High-Performance Optical Sensor Interface Circuits Monolithic and Heterogeneous Optoelectronic Integration (EPIC) Integrated Quantum Photonic Circuits Phase-Locked Loops (PLLs) and Clocking for Optical Transceivers Laser Driver and Modulator Driver ICs Track 3 : Electronics Neuromorphic and Brain-Inspired Electronics Wearable Electronics Signal Processing and Interface Circuits Microsystems and Integration Intelligent Electronics Systems Semiconductor Technologies High-Speed Digital and Mixed-Signal Circuits Flexible and Stretchable Electronics Internet of Things (IoT) Electronics Energy-Efficient Analog and Digital Conversion RF and Wireless Electronics Bio-photonic Wearable Electronics Micro-LED and Nano-LED Display Electronics Photovoltaic Energy Harvesting for IoT Systems FMCW LiDAR System-on-Chip (SoC) Optoelectronic Sensors for Human-Machine Interaction (HMI) Advanced Packaging for Optoelectronic Systems (2.5D/3D)

## Related conferences

- HOT CHIPS — Symposium on High Performance Chips — https://www.myhuiban.com/conference/331
- COOL Chips — IEEE Symposium on Low-Power and High-Speed Chips and Systems — https://www.myhuiban.com/conference/3130
- AI+E — International Conference on AI & Engineering — https://www.myhuiban.com/conference/5399
- AI' — International Conference on Artificial Intelligence and Applications — https://www.myhuiban.com/conference/3462
- ELECTRONICS — International Conference ELECTRONICS — https://www.myhuiban.com/conference/3465

## Related journals

- Analog Integrated Circuits and Signal Processing — https://www.myhuiban.com/journal/1008
- Artificial Intelligence — https://www.myhuiban.com/journal/166
- Robotics and Computer-Integrated Manufacturing — https://www.myhuiban.com/journal/734
- IEEE Transactions on Multimedia — https://www.myhuiban.com/journal/152
- Knowledge-Based Systems — https://www.myhuiban.com/journal/227

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Source: Conference Partner — https://www.myhuiban.com/conference/5622 (rankings reproduced from CCF / ICORE / QUALIS; data cached up to 1 hour)