# ICDIS' — International Symposium on Integrated Circuit Design and Integrated Systems

- **Submission deadline**: 2026-06-15
- **Notification date**: 2026-06-30
- **Conference date**: 2026-08-01
- **Location**: Mongolia, China
- **Conference Partner Index**: 41.4/100 (ranked #4720, confidence 0.45, algorithm 1.1) — how this is computed: https://www.myhuiban.com/ranking
- **Trackers**: 0
- **Attendees**: 0
- **Canonical page**: https://www.myhuiban.com/conference/5569

## Call for papers

The Technical Committee of the 3rd International Symposium on Integrated Circuit Design and Integrated Systems (ICDIS 2026) invites the submission of original research papers in the fields of integrated circuit design and integrated systems. Each submission is anonymously reviewed by an average of three independent reviewers, to ensure the final high standard and quality of submitted papers. Accepted papers will be presented in either oral or poster at the conference. Contributions are sought in the following areas: Analog, Digital, Mixed, and RF Circuits Design Low Power Tools and Designs Techniques Photonic Integrated Circuits (PIC) Design and Optimization CMOS-Compatible Photonic Devices and Applications CMOS Photonic Integrated Chips and Photonic Integrated Technology Combinatorial Logic Gate CMOS Memory and Array Structure Design VLSI Design Advanced Materials for Photonic and Optoelectronic Devices Silicon / Germanium Devices and Device Physics Modeling and Simulation of Organic Semiconductor Devices Test, Fault Tolerance, Reliability and Modelling Interconnect, Low K, High K and Other Process Technologies Integrated Circuits CAD, DFM Signal Processing Techniques for Hybrid Photonic-Electronic Systems Highly Integrated Front-end Circuits and Devices Integrated Circuits for Optical Communications Physical Design of Optoelectronic Integration Circuits and systems Devices and Circuits for Wireless Systems Devices, Hardware and Methods for Bio-Inspired and Neuromorphic Computing Manufacturing, Processing, Packaging and Testing Technology of Optoelectronic Integration and Devices Electronic Design Automation (EDA) Data Path in Digital Processor Architecture Embedded/Multiprocessor Systems Hardware-Software Co-Design and Co-Verification

## Related conferences

- ICDIS — International Conference on Data Intelligence and Security — https://www.myhuiban.com/conference/2927
- ICSICT — International Conference on Solid-State and Integrated Circuit Technology — https://www.myhuiban.com/conference/5273
- SBCCI — International Symposium on Integrated Circuits and Systems Design — https://www.myhuiban.com/conference/600
- ICDV — International Conference on Integrated Circuits, Design, and Verification — https://www.myhuiban.com/conference/4738
- IM — International Symposium on Integrated Network Management — https://www.myhuiban.com/conference/309

## Related journals

- Robotics and Computer-Integrated Manufacturing — https://www.myhuiban.com/journal/734
- International Journal of Computer Integrated Manufacturing — https://www.myhuiban.com/journal/791
- Integrated Computer-Aided Engineering — https://www.myhuiban.com/journal/746
- Analog Integrated Circuits and Signal Processing — https://www.myhuiban.com/journal/1008
- International Journal of Circuit Theory and Applications — https://www.myhuiban.com/journal/915

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Source: Conference Partner — https://www.myhuiban.com/conference/5569 (rankings reproduced from CCF / ICORE / QUALIS; data cached up to 1 hour)