# WAMICON — IEEE Wireless and Microwave Technology Conference

- **Submission deadline**: 2026-02-06
- **Notification date**: 2026-03-09
- **Conference date**: 2026-04-20
- **Location**: Clearwater, Florida, USA
- **Conference Partner Index**: 51.5/100 (ranked #1198, confidence 0.45, algorithm 1.1) — how this is computed: https://www.myhuiban.com/ranking
- **Trackers**: 0
- **Attendees**: 0
- **Canonical page**: https://www.myhuiban.com/conference/5352

## Call for papers

The annual IEEE Wireless and Microwave Technology Conference (WAMICON 2026) plans an engaging program in Clearwater, Florida in April 2026. 2026 marks the 27th year anniversary of WAMICON which addresses multidisciplinary research and technology trends in RF, Microwaves, and Wireless Communications. The program includes both oral and poster presentations as well as workshops, tutorials and special sessions. Clearwater provides a convenient location to the Tampa International Airport (TPA) and the West Coast of Florida. We invite prospective authors to submit original and high-quality work for presentation at WAMICON 2026 and publication in IEEE Xplore. Conference website is www.wamicon.org WAMICON 2026 will be highlighting “Intelligent Heterogeneous Radio Hardware and Emerging Devices for Next-G Wireless and Beyond”. We welcome submissions on all aspects of RF, Microwave, Mm-wave Devices, Circuits and Systems along with hardware and software technologies enabling intelligent communications and sensing: Power Amplifiers (PAs), Active Components, and Systems High-Efficiency & Novel PAs, Linearization and Efficiency Enhancement Techniques, High-Power Devices, Linear/Nonlinear Device Modeling, Transceiver Design, Multi-Band and Digital RF Circuits and Systems, System-On-Chip/Package, Radar RF/MMIC Electronics, Active Filters, Reliability/Thermal Considerations, Wide Bandgap Semiconductors and Epitaxial Material Impacts. Passive Components and Antennas Filters, Transmission Line Components, Advanced Packaging, Antennas and Arrays, Novel Beam-Steering Techniques, Metamaterials, Metasurfaces, Frequency Selective Surfaces, Non-Foster Impedance Matching, Rectifiers. Mm-Wave to THz Technologies 5G/6G Communications, Backhaul, MIMO and Massive MIMO, Beamforming, Human Body Scanners, Radar, SatCom, Vehicle-to-Everything (V2x), Home/Office Application, Tactical Networks/Data Links, mm-wave Packaging, MEMS, and Integrated Circuits. Space & Emerging Applications CubeSats, SmallSats, FlatSats, Remote Sensors, Internet of Space, ASICS & Digital Back Ends, Optical Communications, Machine Learning, Spaceflight Qualification of Wireless Devices and Systems, Biomedical, Energy Harvesting, Wireless Power Transfer, Additive Manufacturing, Aerospace Applications of RF Circuits and System, Space Vehicle Com. Internet of Everything (IoE) & Machine Learning Automotive Systems, Health and Medical Sensors, Machine-to-Machine (M2M), Bluetooth Low Energy (BLE), Light Fidelity (Li-Fi), Near-Field Communication (NFC), RFID, Zigbee, Low-Power Wide-Area Network (LPWAN), Active Denial, Cognitive Radios and Software Defined Radios, Spectrum Management, Wireless Security, AI for RF and Systems, ML applications for RF and Microwave Devices and Systems.​ Authors are asked to submit papers electronically in .PDF format. In order to be considered for publication by the Technical Program Committee, a submission of 3-4 pages, clearly describing the concept and results must be submitted before the deadline of February 6, 2026. Submissions will be evaluated for originality, significance of the work, technical soundness, and interest to a wide audience. We encourage early paper submissions by international authors to accommodate U.S. Visa processing times. The steering committee will provide Visa letters, at the author's request, once the paper is accepted. Please review the following link for updated Visa processing times: https://travel.state.gov/content/travel/en/us-visas/business.html

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