# ICSICT — International Conference on Solid-State and Integrated Circuit Technology

- **Submission deadline**: 2026-06-25
- **Notification date**: 2026-07-25
- **Conference date**: 2026-10-27
- **Location**: Hangzhou, China
- **Conference Partner Index**: 50.2/100 (ranked #1566, confidence 0.45, algorithm 1.1) — how this is computed: https://www.myhuiban.com/ranking
- **Trackers**: 0
- **Attendees**: 0
- **Canonical page**: https://www.myhuiban.com/conference/5273

## Call for papers

Conference Scope: The following are the technical tracks and research directions of ICSICT 2026 (paper submissions are solicited in, but not limited to the following areas) Theme 1: Digital & System Level IC Track 1：Digital Architectures & Systems FPGA Circuits Design & Application Processors, Accelerators & SoCs Memory System & Process in Memory System Level Testability & Reliability Track 2：Digital Circuits Digital Blocks Logical/Physical-Level Security Non-volatile Memory & Volatile Memory Circuit Level Reliability Design Track 3：Design Methodology & EDA Design for Testability, Reliability & Manufacturability Modeling，Simulation & Emulation Design & Technology Co-Optimization Artificial Intelligence Algorithms for EDA Theme 2: Analog Track 4：RF & Wireless Building Blocks at RF, mm-wave and THz Rx, Tx or TRx for Wireless Systems Wireless Sensor, Radar, Imager Device/Packaging/Modeling at RF, mm-wave and THz Track 5：Wireline Electrical/Optical Transmitters/Receivers for Wireline Clock Generation and Distribution Circuits Building Blocks for High-Speed Wireline Communications Track 6：General Analog Advanced Analog Circuits High-Speed, High-Precision Data Converters Imagers, Medical Devices & Display Systems Efficient Power Management Circuits Theme 3: Devices Track 7：CMOS Logic Devices & Sensors Advanced CMOS Logic Devices 2D & Thin Film Devices & Technologies Flash & Non-Volatile & 3D Memory Technologies Sensor, Sensing Microsystem, MEMS, and Bioelectronics Smart/Intelligent Sensors & Actuators Device Modeling & Simulation Track 8：Power Devices & Power IC Silicon-based Power Devices Wide Bandgap Power Devices Power Integrated Circuits、modules & Systems Power Integrating & Packaging Technology Power Device Reliability Power Device Modeling & Simulation Track 9：Device Reliability & Security Back-End of Line Reliability & ESD Aging & Remaining Useful Lifetime Prediction PUF & Hardware Security Devices Radiation Reliability Theme 4: Process & Technologies Track 10：Semiconductor Process Technologies Compound Semiconductor Materials & Technologies Advanced Memory Materials & Technologies Advanced Process Technologies Advanced Interconnect Technologies Process Modeling & Simulation Track 11：Optoelectronics and Silicon Photonics Integration High-Speed Optoelectronic Devices Silicon Photonics & Integration Photonic Sensors & Image Sensors Optical Computing Devices Display Process & Integration Track 12：Packaging Technologies 2.5D & 3D Integration Heterogeneous Integration Packaging Advanced Wire Bonding Technology Modeling and Simulation for Advanced Packaging Testing and Reliability in Advanced Packaging

## Related conferences

- ICDIS' — International Symposium on Integrated Circuit Design and Integrated Systems — https://www.myhuiban.com/conference/5569
- A-SSCC — Asian Solid-State Circuits Conference — https://www.myhuiban.com/conference/4404
- ISSCC — IEEE International Solid-State Circuits Conference — https://www.myhuiban.com/conference/713
- SIGIR — International Conference on Research and Development in Information Retrieval — https://www.myhuiban.com/conference/141
- AAAI — AAAI Conference on Artificial Intelligence — https://www.myhuiban.com/conference/408

## Related journals

- Solid State Sciences — https://www.myhuiban.com/journal/1195
- Solid State Ionics — https://www.myhuiban.com/journal/1232
- International Journal of Circuit Theory and Applications — https://www.myhuiban.com/journal/915
- Solid State Nuclear Magnetic Resonance — https://www.myhuiban.com/journal/1217
- IEEE Solid-State Circuits Magazine — https://www.myhuiban.com/journal/1167

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Source: Conference Partner — https://www.myhuiban.com/conference/5273 (rankings reproduced from CCF / ICORE / QUALIS; data cached up to 1 hour)