# NordPac — IMAPS Nordic Microelectronics Packaging Conference and Exhibition

- **Submission deadline**: 2024-01-31
- **Notification date**: 2024-06-01
- **Conference date**: 2024-06-11
- **Location**: Tampere, Finland
- **Conference Partner Index**: 41.7/100 (ranked #4714, confidence 0.45, algorithm 1.1) — how this is computed: https://www.myhuiban.com/ranking
- **Trackers**: 0
- **Attendees**: 0
- **Canonical page**: https://www.myhuiban.com/conference/4743

## Call for papers

Topics Proposed topics of microelectronics and packaging include: Optoelectronics Harsh environment Applications Advanced Packaging Electronics Reliability & Quality Materials & Processes Medical electronics Power electronics Wearable electronics Green Technologies Printed electronics Advanced packaging for MEMS & sensors & sensor systems

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Source: Conference Partner — https://www.myhuiban.com/conference/4743 (rankings reproduced from CCF / ICORE / QUALIS; data cached up to 1 hour)