# BMSAI — International Conference on Biometrics, Microelectronic Sensors and Artificial Intelligence

- **Submission deadline**: 2022-03-20
- **Conference date**: 2022-03-25
- **Location**: Sanya, China
- **Conference Partner Index**: 35.8/100 (ranked #5622, confidence 0.45, algorithm 1.1) — how this is computed: https://www.myhuiban.com/ranking
- **Trackers**: 0
- **Attendees**: 0
- **Canonical page**: https://www.myhuiban.com/conference/4325

## Call for papers

2022 International Conference on Biometrics, Microelectronic Sensors and Artificial Intelligence (BMSAI 2022) will bring together leading researchers, engineers and scientists in the domain of interest from around the world. Topics of interest for submission include, but are not limited to: Machinery and production technology Fingerprint recognition, vein recognition and other applications Biometric acquisition device Evaluation and enhancement of biometric signal quality Biometric-based emotional computing Identification and processing of other biometrics Multimodal biometrics and information fusion Biometric database construction and synthesis Large-scale biometric identification systems Biometric system anti-counterfeiting and security Biometric system evaluation and application Microelectronic sensors Research and development of new devices and processes Advanced system packaging and 3D integration Integrated circuit equipment materials Digital integrated circuits and systems Analog/RF circuits and systems Memory architecture and design New computing architecture chip design Open source chips and agile development Reliability technology and measurable design IoT and smart sensor design Healthcare and intelligent terminal design Preparation of new materials Chemical sensors and electrochemical sensors Optical sensors and biosensors Electrobiochemilumine sensors and biosensors Sensor membrane or nanosensor Novel sensor concepts and new quantitative methods Artificial intelligence Machine learning Natural language processing Intelligent robot Artificial Intelligence Modeling and Simulation Pervasive computing and environmental intelligence Automatic control Build product/system lifecycle datasets with AI Ai-enabled modeling and design of materials, metamaterials, and material systems Computer Vision and Speech Understanding Data mining and machine learning tools Artificial Intelligence applied to the Internet of Things (IoT) Ai-aided design of mechanisms and other mechanical systems Heuristics and AI planning strategies and tools Hybrid intelligent system Multimedia and Cognitive Informatics Mechatronics

## Related conferences

- SENSORS — IEEE Sensors — https://www.myhuiban.com/conference/871
- Artificial Intelligence — International Conference on Automation and Artificial Intelligence — https://www.myhuiban.com/conference/3369
- SIGIR — International Conference on Research and Development in Information Retrieval — https://www.myhuiban.com/conference/141
- AAAI — AAAI Conference on Artificial Intelligence — https://www.myhuiban.com/conference/408
- CVPR — IEEE Conference on Computer Vision and Pattern Recognition — https://www.myhuiban.com/conference/407

## Related journals

- Microelectronic Engineering — https://www.myhuiban.com/journal/406
- Sensors — https://www.myhuiban.com/journal/559
- Measurement: Sensors — https://www.myhuiban.com/journal/1105
- IEEE Transactions on Biometrics, Behavior, and Identity Science — https://www.myhuiban.com/journal/1048
- IEEE Transactions on Multimedia — https://www.myhuiban.com/journal/152

---
Source: Conference Partner — https://www.myhuiban.com/conference/4325 (rankings reproduced from CCF / ICORE / QUALIS; data cached up to 1 hour)