# MDTS — Microelectronics Design and Test Symposium

- **Submission deadline**: 2027-01-10
- **Notification date**: 2027-02-21
- **Conference date**: 2027-05-17
- **Location**: Albany, New York, USA
- **Conference Partner Index**: 56.2/100 (ranked #758, confidence 0.45, algorithm 1.1) — how this is computed: https://www.myhuiban.com/ranking
- **Trackers**: 0
- **Attendees**: 0
- **Canonical page**: https://www.myhuiban.com/conference/4072

## Past editions

| Year | Deadline | Conference date | Location |
|---|---|---|---|
| 2021 | 2021-03-30 | 2021-05-18 | Albany, New York, USA |

## Call for papers

Theme Topics The Program Committee invites researchers and practitioners to submit tutorial, panel, and special session proposals. The committee also encourages authors to submit original, unpublished papers. Topics of interest include, but are not limited to: Hardware Security Microarchitectural attacks Side channel attacks and mitigation (Anti –)Reverse engineering and physical attacks Fault attacks Hardware obfuscation Computer-aided design (CAD) for security SoC security, Field-programmable gate array (FPGA) and reconfigurable fabric security Internet-of-Things (IoTs) and cyber physical system security Micro Devices, Circuits and Microsystems Analog/mixed-signal/radio frequency (RF) circuits Low-power low-voltage design Sensors and sensing systems Smart system design for automotive, automation and robotics Circuits and systems for approximate and evolvable computing Memristor-based devices Lab-on-Chip, wearable and implantable devices Heterogeneous integration and multi-scale chiplet-based packaging architecture Biomedical, Photonics, and Quantum Electronics Biomedical and bio-inspired circuits and systems Microelectromechanical systems (MEMS) sensors and bioelectronics Nanobiophotonics for optical imaging, sensing, and diagnostics Terahertz photonics for communications Photodetectors, sensors, and imaging Photonics for energy and green photonics AI/ML integration with biodevices Micro/Nano electronics for biosensing and bio-actuation Electronic Design & Test Methodologies and Electronic Design Automation (EDA) Electronic design tools, processes and methodologies EDA for 3D integrations and advanced packaging EDA for bio-inspired and neuromorphic systems EDA tools, methodologies and applications for Photonics devices, circuit, and system design System-on-Chip (SoC)/intellectual property (IP) testing strategies Hardware/software co-verification Design for testability (DFT) & built-in self-test (BIST) for digital designs, analog/mixed-signal integrated circuits (ICs), SoCs, and memories Design verification/validation Machine learning datasets for microelectronics design and test Emerging Technologies, Materials, and Applications Emerging low-dimensional materials (carbon nanotubes, transition metal dichalcogenides, and metal oxides). Computing-in-memory architectures Neural networks, AI, ML, and DL in design and test of microelectronics IoT, edge nodes, or pipelines for real-time data visualizations and monitoring in design and test of microelectronics Application of cognitive, neuromorphic and quantum computing High-speed serializer/ deserializer (SerDes) Next-generation design-technology co-optimization Advanced interconnect 3D manufacturing Quantum Computing Power Electronics and Applications Power conversion topologies Energy storage systems Power electronic packaging Electric Vehicles (EV) and charging infrastructure Wireless power transfer

## Related conferences

- IDT — IEEE International Design & Test Symposium — https://www.myhuiban.com/conference/1818
- SIGIR — International Conference on Research and Development in Information Retrieval — https://www.myhuiban.com/conference/141
- AAAI — AAAI Conference on Artificial Intelligence — https://www.myhuiban.com/conference/408
- CVPR — IEEE Conference on Computer Vision and Pattern Recognition — https://www.myhuiban.com/conference/407
- ICRA — International Conference on Robotics and Automation — https://www.myhuiban.com/conference/421

## Related journals

- IEEE Design & Test — https://www.myhuiban.com/journal/1162
- Microelectronics Journal — https://www.myhuiban.com/journal/405
- Microelectronics Reliability — https://www.myhuiban.com/journal/404
- Russian Microelectronics — https://www.myhuiban.com/journal/537
- IEEE Transactions on Multimedia — https://www.myhuiban.com/journal/152

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Source: Conference Partner — https://www.myhuiban.com/conference/4072 (rankings reproduced from CCF / ICORE / QUALIS; data cached up to 1 hour)