# COOL Chips — IEEE Symposium on Low-Power and High-Speed Chips and Systems

- **Submission deadline**: 2027-02-05
- **Notification date**: 2027-03-12
- **Conference date**: 2027-04-14
- **Location**: Tokyo, Japan
- **Conference Partner Index**: 56.0/100 (ranked #788, confidence 0.45, algorithm 1.1) — how this is computed: https://www.myhuiban.com/ranking
- **Trackers**: 1
- **Attendees**: 1
- **Canonical page**: https://www.myhuiban.com/conference/3130

## Past editions

| Year | Deadline | Conference date | Location |
|---|---|---|---|
| 2025 | 2025-02-07 | 2025-04-16 | Tokyo, Japan |

## Call for papers

COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 30 is to be held in Tokyo on April 14-16, 2027, and is targeted at the architecture, design, and implementation of chips and systems with special emphasis on the areas listed below. All papers are published online via IEEE Xplore. Especially, selected papers are encouraged to submit to the IEEE Micro and the special section in the IEICE Transactions on Electronics. Contributions are solicited in the following areas: Low Power-High Performance Processors and Systems for – AI, IoT, Multimedia, Digital Consumer Electronics, Mobile, Graphics, Encryption, Robotics, Automotive, Networking, Medical, Healthcare, and Biometrics. Novel Architectures and Schemes for – Single Core, Multi/Many-Core, NoC, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous, Dependable Computing, GALS and 3D Integration Cool Software including – Parallel Schedulers, Embedded Real-time Operating System, Binary Translations, Compiler Issues and Low Power Application Techniques.

## Related conferences

- HOT CHIPS — Symposium on High Performance Chips — https://www.myhuiban.com/conference/331
- ISCS — International Symposium on Chips and Semiconductors — https://www.myhuiban.com/conference/4355
- AICsE — International Conference on AI Chips, Integrated Circuits and Electronics — https://www.myhuiban.com/conference/5622
- CooIDC — USENIX Workshop on Cool Topics in Sustainable Data Centers — https://www.myhuiban.com/conference/1826
- SIGIR — International Conference on Research and Development in Information Retrieval — https://www.myhuiban.com/conference/141

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Source: Conference Partner — https://www.myhuiban.com/conference/3130 (rankings reproduced from CCF / ICORE / QUALIS; data cached up to 1 hour)
