Información de la Revista
IEEE Micro
https://www.computer.org/csdl/magazines/miFactor de Impacto: |
3.172 |
Editor: |
IEEE |
ISSN: |
0272-1732 |
Vistas: |
16579 |
Seguidores: |
12 |
Solicitud de Artículos
IEEE Micro, a bimonthly publication of the IEEE Computer Society, reaches an international audience of microcomputer and microprocessor designers, system integrators, and users. Readers want to increase their technical knowledge of computers and peripherals; systems, components, and subassemblies; communications, instrumentation, and control equipment; and software.
Última Actualización Por Dou Sun en 2021-04-08
Special Issues
Special Issue on Contemporary Industry ProductsDía de Entrega: 2024-03-31There is great value in papers about computing systems and platforms developed by industry that apply or combine novel ideas. Such papers are unlikely to be accepted by conferences in the current reviewing ecosystem. Retrospective industrial product papers remain valuable complements to academic research papers. Hence, we have a special issue for commercial products. Here are the guidelines for this special issue: - Ideal submissions will describe and evaluate (1) working products, (2) upcoming products firmly in product roadmaps, and/or (3) planned products that were canceled but present interesting insights or lessons learned. Ideal submissions should motivate the value of the product, describe the technical complexities that need(ed) to be addressed and the novel solutions developed to do so, and (critically) summarize the key insights and lessons learned. - This special issue of IEEE Micro is not intended for (1) research projects, (2) short-term student internship or faculty sabbatical projects, or (3) speculation about products that might be built. - The first author and most of the co-authors of papers selected for this special issue of IEEE Micro must work in industry.
Última Actualización Por Dou Sun en 2024-03-20
Special Issue on Interconnects for Chiplet Integration TechnologiesDía de Entrega: 2024-04-15As Moore’s Law slows down, integrating more transistors and system components in a single monolithic die has become challenging and expensive. This has spurred innovations in chiplet integration technologies, including packaging and chiplet-to-chiplet interconnect technologies that can best exploit unique opportunities given by the chiplet technologies. Leading such a technology trend, the industry has already introduced volume products, connecting multiple chiplets with proprietary interconnect technologies. Meanwhile, the need to broaden the participation and ecosystem for chiplet integration technologies has also driven open standards for chiplet interconnect technologies, such as Universal Chiplet Interconnect Express™ (UCIe), High Bandwidth Memory (HBM), and extra short reach (XSR). This special issue of IEEE Micro seeks articles on broad topics that relate to recent chiplet-to-chiplet interconnect technologies, their impact on future processor, accelerator, and memory architectures, and their novel applications. Topics include, but are not limited to: - Chiplet-to-chiplet interconnect protocols and models. - Co-design of inter-chiplet, -package, and -system interconnect protocols. - Innovative processor, accelerator, and memory architectures, for various applications (e.g., automotive, AI, datacenter, etc.), exploiting chiplet integration and interconnect technologies. - Testability, manageability, reliability, and debuggability of chiplet-based designs. - Packaging technologies and challenges for chiplet-based designs.
Última Actualización Por Dou Sun en 2024-03-20
Los Mejores Artículos
Año | Los Mejores Artículos |
---|---|
2018 | Loihi: A Neuromorphic Manycore Processor with On-Chip Learning |
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Conferencias Relacionadas
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TICST | International Conference on Science and Technology | 2017-09-15 | 2017-09-30 | 2017-12-07 | |||
c | b | a1 | Globecom | IEEE Global Communications Conference | 2024-04-01 | 2024-08-01 | 2024-12-08 |
MDSIS | Asia Conference on Mathematics, Data Science and Information System | 2023-09-20 | 2023-10-05 | 2023-10-27 | |||
c | b4 | CIMSA | International Conference on Computational Intelligence for Measurement Systems and Applications | 2012-04-15 | 2012-04-30 | 2012-07-02 | |
GIoTS | Global IoT Summit | 2020-03-08 | 2020-04-15 | 2020-06-03 | |||
b | a | a2 | Middleware | International Middleware Conference | 2024-05-24 | 2024-09-06 | 2024-12-02 |
CACS' | International Automatic Control Conference | 2018-08-31 | 2018-09-25 | 2018-11-04 | |||
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Abreviación | Nombre Completo | Entrega | Conferencia |
---|---|---|---|
TICST | International Conference on Science and Technology | 2017-09-15 | 2017-12-07 |
Globecom | IEEE Global Communications Conference | 2024-04-01 | 2024-12-08 |
MDSIS | Asia Conference on Mathematics, Data Science and Information System | 2023-09-20 | 2023-10-27 |
CIMSA | International Conference on Computational Intelligence for Measurement Systems and Applications | 2012-04-15 | 2012-07-02 |
GIoTS | Global IoT Summit | 2020-03-08 | 2020-06-03 |
Middleware | International Middleware Conference | 2024-05-24 | 2024-12-02 |
CACS' | International Automatic Control Conference | 2018-08-31 | 2018-11-04 |
INC | International Network Conference | 2020-07-30 | 2020-09-19 |
ESTEL | IEEE-AESS European Conference on Satellite Telecommunications | 2012-04-01 | 2012-10-02 |
ESIHISE | International Conference on Evolution of the Sciences, Informatics, Human Integration and Scientific Education | 2019-09-27 | 2019-10-03 |
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