Conference Information
UEMCON 2017 : IEEE Annual Ubiquitous Computing, Electronics & Mobile Communication Conference
http://ieee-uemcon.org/
Submission Date:
2017-08-14 Extended
Notification Date:
2017-08-25
Conference Date:
2017-10-19
Location:
New York City, New York, USA
Years:
8
Viewed: 1301   Tracked: 2   Attend: 0

Conference Location
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Call For Papers
Continuing from the success of IEEE UEMCON 2016, we are proud to present IEEE UEMCON 2017 which will provide an opportunity for researchers, educators and students to discuss and exchange ideas on issues, trends, and developments in Computing, Electronics and Mobile Communication. The conference aims to bring together scholars from different disciplinary backgrounds to emphasize dissemination of ongoing research in the fields of in Computing, Electronics and Mobile Communication. Contributed papers are solicited describing original works in the above mentioned fields and related technologies. The conference will include a peer-reviewed program of technical sessions, special sessions, business application sessions, tutorials, and demonstration sessions. All accepted papers will be presented during the parallel sessions of the Conference and papers will be submitted for publication at IEEE Xplore Digital Library IEEE UEMCON 2017 is listed in IEEE conference listing here.

This conference will also promote an intense dialogue between academia and industry to bridge the gap between academic research, industry initiatives, and governmental policies. This is fostered through panel discussions, keynotes, invited talks and industry exhibits where academia is exposed to state-of-practice and results from trials and interoperability experiments. The industry in turn benefits by exposure to leading-edge research in networking as well as the opportunity to communicate with academic researchers regarding practical problems that require further research.

One of the world’s great cities, New York City (known as “The Big Apple”, “NYC,” or just “New York”) is a global center for media, entertainment, art, fashion, research, finance, and trade. The bustling, cosmopolitan heart of the 4th largest metropolis in the world and by far the most populous city in the United States, New York has long been a key entry point and a defining city for the nation. From the Statue of Liberty in the harbor to the Empire State Building towering over the Manhattan skyline, from the tunnels of the subway to the skyscrapers of Wall Street, from the bright signs of Times Square to the naturalistic beauty of Central Park, and from Yankee Stadium in the Bronx to Coney Island in Brooklyn, New York’s landmarks are quintessential American landmarks. Please see the beauty of New York here.

Prospective authors are invited to submit manuscripts reporting original unpublished research and recent developments in the topics related to the conference. It is required that the manuscript follows the standard IEEE camera-ready format (IEEE standard format, double column, 10-point font). Submissions must include title, abstract, keywords, author and affiliation with email address. Please double-check the paper size in your page setup to make sure you are using the letter-size paper layout (8.5 inch X 11 inch). The paper should not contain page numbers or any special headers or footers.

The IEEE templates in Microsoft Word (US Letter) and LaTeX format can be found at :

http://www.ieee.org/conferences_events/conferences/publishing/templates.html

Details can also be found in the Call for Papers PDF file: here

UEMCON Paper Categories

    Regular Paper – 7 pages maximum (3 additional pages allowed but at an extra charge)
    Short Paper (Work-in-Progress) – 6 pages maximum (2 additional pages allowed but at an extra charge)
    Poster – 5 pages maximum

Regular papers should present novel perspectives within the general scope of the conference. Short papers (Work-in-Progress) are an opportunity to present preliminary or interim results. Posters are intended for ongoing research projects, concrete realizations, or industrial applications/projects presentations.
Last updated by Dou Sun in 2017-07-22
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